1. The most important step for a successful Mor-Flexx repair is to make the surrounding area as clean as possible - that means removing all loose and foreign matter with a thorough wire brushing, even if it looks "clean."
2. If dirt or oils are present, wash with any household cleaner, rinse to remove and allow to dry.
   
3. Wire brush the crack or chipped area (or use a drill with a wire wheel) to loosen and remove any poorly bonded material, and to provide good surfaces for adhesion. Use a vacuum cleaner (intake or exhaust), compressed air, or a wet rag or sponge to completely remove all loose material and dust.
   
4. If crack depth is greater than 1" (25mm), appropriate size backing rod may be inserted to about 3/8"-1/2" (10-13mm) below surface for a stronger, longer lasting seal that actually uses less Mor-Flexx.
   

1. Insert cartridge into a standard 2" caulk gun, cut nozzle to desired opening.
   
2. Gun Mor-Flexx into the crack and work it into the sides with a scraper or other tool for complete sealing and adhesion; repeat until filled.
   
3. Smooth out exposed filled area with a foam paintbrush, sponge or scraper, making it flush with the joint.
   
4. Natural shrinkage will give the seal a concave appearance; more applications may be needed to fill the joint flat.
   
5. If painting is desired, wait at least one day after the last application.
   
6. Clean-up tools and hands with warm water and soap.
   
7. Leftover Mor-Flexx can be stored if the nozzle is tightly wrapped with plastic wrap and a rubber band.

Helpful Application Tips
Mor-Flexx, and all water-cleanup products, cure by water evaporation. Temperatures below 40°F, humidity higher than 50%, no direct sunlight, and the size of the filled area can all affect the time Mor-Flexx needs to fully cure. Mor-Flexx can be applied in damp areas, but should not be exposed to rain until cured. Alcohol and/or water in a spray bottle may be used to slow skinning (the initial drying of the exposed joint area) above 70°F (21°C) or in hot, direct sunlight.